Adhesion and thermal deformation of ceramic/polymer heterostructures
Materials Research Society Symposium - Proceedings
The adhesion and thermal properties of optical ceramic structures bonded by a polymer interlayer are explored. The mechanical, adhesion and optical properties of the heterostructure are dependent on the thickness of the bond and on the residual thermal stresses developed during the bonding process. The thermomechanical properties of a bonded structure over a range of temperatures are investigated, focusing on the thermal expansion and operating temperature limits of the polymer bond. The temperature and stress histories during manufacturing are determined through both numerical modeling and experimental analysis. The effect of stress relaxation and initial stresses on the behavior of the bonding material are examined for different processing conditions. The bond material relaxation time constant, activation energy, viscosity, and shear modulus are approximated from observation of the temperature-dependent behavior of the structure.
Madras, C., Wong, P., & Miaoulis, I. (1995). Adhesion and thermal deformation of ceramic/polymer heterostructures. Materials Research Society Symposium - Proceedings, 385, 71-76. https://doi.org/10.1557/proc-385-71