Viscoelastic behavior of polymer thin-films under thermal stresses
Document Type
Conference Proceeding
Publication Title
Materials Research Society Symposium - Proceedings
Publication Date
12-1-1997
Abstract
Stresses and deformation in microelectronic packaging are affected by the viscoelastic behavior of polymer materials during manufacture or operation. Predicting and measuring these thermo-mechanical effects is important for new devices, components, and materials. The viscoelastic response of Nycoa 851 polyimide thin-films during thermal loading is investigated. The time-dependent relaxation of polyimide films was measured in-situ, focusing on the change in thermo-mechanical properties based on the thickness of the polyimide layer. The curvature change of the multilayer structure (silver-polyimide-quartz heterostructure) was obtained for different temperatures and polymer film thicknesses. The polyimide relaxation time constant and activation energy were determined. Results indicate that the thermo-mechanical properties of polyimide thin films are dependent on the thickness of the polymer layer.
Volume
445
First Page
185
Last Page
190
Recommended Citation
Bluestein, S., Bramono, D., Miaoulis, I., & Wong, P. (1997). Viscoelastic behavior of polymer thin-films under thermal stresses. Materials Research Society Symposium - Proceedings, 445, 185-190. Retrieved from https://docs.rwu.edu/seccm_fp/156
ISSN
02729172
