Title

Viscoelastic behavior of polymer thin-films under thermal stresses

Document Type

Conference Proceeding

Publication Title

Materials Research Society Symposium - Proceedings

Publication Date

12-1-1997

Abstract

Stresses and deformation in microelectronic packaging are affected by the viscoelastic behavior of polymer materials during manufacture or operation. Predicting and measuring these thermo-mechanical effects is important for new devices, components, and materials. The viscoelastic response of Nycoa 851 polyimide thin-films during thermal loading is investigated. The time-dependent relaxation of polyimide films was measured in-situ, focusing on the change in thermo-mechanical properties based on the thickness of the polyimide layer. The curvature change of the multilayer structure (silver-polyimide-quartz heterostructure) was obtained for different temperatures and polymer film thicknesses. The polyimide relaxation time constant and activation energy were determined. Results indicate that the thermo-mechanical properties of polyimide thin films are dependent on the thickness of the polymer layer.

Volume

445

First Page

185

Last Page

190

ISSN

02729172

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