Prediction of elastic strains in adhesively bonded diamond optical disks
An elastic strain numerical model was used to predict the stresses, radius of curvature and deflection of thick diamond films bonded at elevated temperatures to silicon, germanium and zinc sulphide substrates. A range of bonding temperatures from 100 to 350°C and diamond to substrate thickness ratios from 0·001 to 0·5 was modelled. The thermal stresses throughout the structure after bonding are shown for each theoretical condition. Also, the edge to centre deflection caused by thermal stresses is reported for each bonding condition. When bonding thick diamond films at higher temperatures, the stresses within the Ge and ZnS substrates were predicted to exceed their rupture strengths.
Madras, C., Wong, P. Y., & Miaoulis, I. (1997). Prediction of elastic strains in adhesively bonded diamond optical disks. Glass Technology, 38 (2), 65-70. Retrieved from https://docs.rwu.edu/seccm_fp/158